Designed to seal openings in new or existing raised floor cutouts used for communications or power cabling. Based
on measurements at multiple data centers, on average 48% of valuable conditioned air is not reaching the air intake of IT
equipment due to unsealed floor openings. This lost air, known as bypass airflow, contributes to IT equipment hot spots,
cooling unit inefficiencies, and increasing infrastructure costs. KoldLok® products specifically address bypass airflow and its detrimental effects on data center cooling.
Dimensions: 7.50″ x 7.39″ x 1.64″ (190.5mm x 187.71mm x 41.66mm)
Four (4) Self-Drilling Screws Are Provided For Installation
(Sold by Case – Case includes 10 grommets)